|
|
|
The technical folders describe the processes applied during the manufacturing and test of Semiconductor devices organized by chronological steps and point out the equipment and accessories typically used during these processes.
MW technical support is present in most of these areas and brings its expertise to link these processes between them, understand what equipment is commonly used, what the suppliers offer, and how a new process could be developed or an existing one be enhanced.
|
|
|
|
|
1 - Characterization by C-V
A well-known method which consists of measuring the capacitance in function of the voltage while varying the frequency of the applied signal ...
2 - Measurement of sheet resistivity by Four point probe method
The four point probe method will measure the sheet resistivity of a semiconductive layer deposited onto a substrate. Depending upon the probes spacing, the size of the measured substrate ...
3 - Hall effect measurement
The Hall effect was discovered by M. Hall, A Johnes Hopkins university professor. If a magnetic flux is applied to a conductor in which a current is flowing, it creates an electronic ...
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1 - Introduction
The dicing process arises at the end of the wafer manufacturing to separate the chips or after deposition of semiconductor based materials to isolate the device to characterize ...
2 - Adhesive plastic tapes for dicing (include UV tapes)
The adhesive tapes are widely used to maintain the substrate or wafer before dicing. It is indeed like a standard adhesive tape used in all offices except that the characteristics both ...
3 - Dicing wheels with metal and resin bond
Microelectronic materials, wafers, ceramic or other substrates, thin glasses coated with electronic layers…of thicknesses ranging from 0.1mm to 2 or 3 mm can be cut with specific dicing machine and ...
4 - Manual equipment for film frame mounting, UV curing, expansion
Usually, the wafers or substrates to dice are sticked onto a plastic adhesive tape, being itself tensed over a metal frame. The assembly is then put on the dicing machine and a vacuum system holds the wafer ...
5 - Accessories used in the dicing processes
This section concerns the product used as "consumable", such as dicing blades, adhesive tapes, wafer film frame and plastic grip-rings (used in the expansion process). Other products last more but need care and ...
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Electrical characterization of semiconductor layers
