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The technical folders describe the processes applied during the manufacturing and test of Semiconductor devices, they are organized by chronological steps…
 
Electrical characterization of semiconductor layers
1 - What is the "Hall effect" and what results do you obtain with the measurements ?
2 - I need to measure a "very high" sheet resistivity, what would you suggest ?
3 - What is the budget price for a simple Four Point Probe ?
4 - Is it possible to measure the resistivity of some materials while heating up the sample ?
5 - What are the advantages/disadvantages of using a C-V station with Mercury contact ?
Semiconductor Wafers Back-Grinding (Back-Thinning)
6 - What is the purpose of this process ?
7 - What products does the BG process imply and what does MW propose ?
Visual inpection & Visual
8 - There are many microscopes and optical products, some of them very known as there are used within all research labs and production areas. How do you make a difference with your product offering ?
9 - How about cameras to be used with ?
10 - Concerning objectives, you offer in addition to your own models some of known brand, such as Mitutoyo or others. These objectives can be purchased directly from the manufacturers ?
Probing of Micro-Structure
11 - Our wafers/substrates are ranging from 2" to 8" diameter, they can be square or round partial. We would like to characterize some internal devices and contact with needles. The size of the contact pads is 80x80µm, in some cases it could be smaller ?
Dicing of Silicon & other substrates
12 - What is the particularity & recommended applications of the adhesive tapes for dicing with ultraviolet sensitive adhesive ?
13 - How long should a resin dicing blade last ?
Final Test (Components & Wafers), Burn-In & Environmental Tests
14 - What is the difference between antistatic bags and moisture barrier bags ?
 
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