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The Products list classification respects the chronological Steps of manufacturing.
Click on a category to display the related products 
   ELECTRICAL CHARACTERIZATION OF SEMICONDUCTIVE LAYERS
      CHARACTERIZATION BY C-V
            C-V characterization Equipment
            Options & Accessories / C-V characterization
      RESISTIVITY MEASUREMENT BY 4-POINT PROBE METHOD
            Sheet resistivity 4 point probe systems
                        Mercury 4 point Probe
            4 point probe heads for resistivity measurement
            Micropositioner specific for 4 point probe head
            Options & Accessories / Resistivity measurements
      CHARACTERIZATION BY HALL EFFECT
            Hall effect & Other parameters measurement Equipment
            Options & Accessories / Hall effect characterization
   WAFER BACKGRINDING & BACKTHINNING
      BACKTHINNING OF INDIVIDUAL DIES (Service)
      ADHESIVE TAPE FOR BACKGRINDING
      UV CURING SYSTEMS
      WAFER BACKLAPPING FILM APPLICATION & REMOVAL
            Wafer backlapping film laminators & Removal
            Options & Accessories for wafer backgrinding lamination & Removal
      BACKGRINDING WHEELS FOR WAFERS
   VISUAL INSPECTION & OPTICS
      Microscopes & Binocular
      Objectives and eyepieces
      Cameras & Other accessories
   PROBING OF MICROSTRUCTURES
      PROBERS FOR ELECTRICAL ANALYSIS AND CHARACTERIZATION
            General purpose probers (design, failure analysis, small production...)
            Specific (RF&Microwave-MEMs...) probers
      ACCESSORIES FOR PROBERS
            Microscopes
            Anti-vibration tables
            Precision micropositioners
            Microtools (MEMs testing, biological...)
            Probe holders
            Probe needles
            Specific probes (active-Coaxial-Kelvin...)
            Thermal chucks - Temperature testing
            Lasers for removing metal and layers
            Miscellaneous other accessories
            Specific accessories for RF & Microwave applications
                        Specific RF positioner
                        Microwave-applications probes
                        RF & microwave cables
      HIGH DENSITY & VERTICAL PROBECARDS
      CLEANING SHEETS FOR PROBECARDS ONLINE CLEANING
   DICING OF SILICON AND OTHER SUBSTRATES
      DICING MACHINE
      ADHESIVE TAPES FOR WAFERS & SUBSTRATES
            Standard adhesive tapes
            UV adhesive film
      WAFER/FRAME FILM LAMINATION
            Wafer/Frame film mounters
            Options & Accessories
      DIAMOND DICING WHEELS FOR ALL THIN MATERIALS
            Hubless type used with mounting flanges
            Hubtype blade ready to use
      ULTRAVIOLET FILM IRRADIATORS
            UV curing equipment
            Manual UV lamps
            Options & Acessories
      FILM EXPANSION AFTER DICING
      CLEANING & BRUSHING AFTER DICING
      ACCESSORIES RELATED TO DICING
            Plastic rings & Metal frames
            Mounting flanges for Hubless blades
            Other accessories related to dicing
   TESTS OF FINISHED COMPONENTS & BURN IN
      STANDARD SOCKETS FOR BURN IN AND TESTS
            BGA/CSP, LGA Packages
            QFN packages
            Sockets Axial-Radial & MELF packages
            Sockets for TO, SIP, DIP packages
            LCC, FlatPack, SMD, Microwave & Hybrids
            ZigZag sockets & Staggered
            Sockets for PLCC/SOJ & "Gull Wing" packages
            Optical transceiver sockets & PGA
            Connectors
      BURN IN BOARDS - HUMIDITY & HAST BOARDS
      SPRING POGO PINS
      TESTS INTERFACE BOARDS
      INSTRUMENTS & SOFTWARES
   COMPONENT HANDLING & PACKAGING MATERIALS
      Materials for ESD protection
      Microhandling & Micro-tools
   SUBCONTRACT SERVICES PROTOTYPES
 
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