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The guided search will list the products by their classification (organized by chronological steps of
manufacturing & testing).
ELECTRICAL CHARACTERIZATION OF SEMICONDUCTIVE LAYERS
CHARACTERIZATION BY C-V
C-V characterization Equipment
Options & Accessories / C-V characterization
RESISTIVITY MEASUREMENT BY 4-POINT PROBE METHOD
Sheet resistivity 4 point probe systems
Mercury 4 point Probe
4 point probe heads for resistivity measurement
Micropositioner specific for 4 point probe head
Options & Accessories / Resistivity measurements
CHARACTERIZATION BY HALL EFFECT
Hall effect & Other parameters measurement Equipment
Options & Accessories / Hall effect characterization
WAFER BACKGRINDING & BACKTHINNING
BACKTHINNING OF INDIVIDUAL DIES (Service)
ADHESIVE TAPE FOR BACKGRINDING
UV CURING SYSTEMS
WAFER BACKLAPPING FILM APPLICATION & REMOVAL
Wafer backlapping film laminators & Removal
Options & Accessories for wafer backgrinding lamination & Removal
BACKGRINDING WHEELS FOR WAFERS
VISUAL INSPECTION & OPTICS
Microscopes & Binocular
Objectives and eyepieces
Cameras & Other accessories
PROBING OF MICROSTRUCTURES
PROBERS FOR ELECTRICAL ANALYSIS AND CHARACTERIZATION
General purpose probers (design, failure analysis, small production...)
Specific (RF&Microwave-MEMs...) probers
ACCESSORIES FOR PROBERS
Microscopes
Anti-vibration tables
Precision micropositioners
Microtools (MEMs testing, biological...)
Probe holders
Probe needles
Specific probes (active-Coaxial-Kelvin...)
Thermal chucks - Temperature testing
Lasers for removing metal and layers
Miscellaneous other accessories
Specific accessories for RF & Microwave applications
Specific RF positioner
Microwave-applications probes
RF & microwave cables
HIGH DENSITY & VERTICAL PROBECARDS
CLEANING SHEETS FOR PROBECARDS ONLINE CLEANING
DICING OF SILICON AND OTHER SUBSTRATES
DICING MACHINE
ADHESIVE TAPES FOR WAFERS & SUBSTRATES
Standard adhesive tapes
UV adhesive film
WAFER/FRAME FILM LAMINATION
Wafer/Frame film mounters
Options & Accessories
DIAMOND DICING WHEELS FOR ALL THIN MATERIALS
Hubless type used with mounting flanges
Hubtype blade ready to use
ULTRAVIOLET FILM IRRADIATORS
UV curing equipment
Manual UV lamps
Options & Acessories
FILM EXPANSION AFTER DICING
CLEANING & BRUSHING AFTER DICING
ACCESSORIES RELATED TO DICING
Plastic rings & Metal frames
Mounting flanges for Hubless blades
Other accessories related to dicing
TESTS OF FINISHED COMPONENTS & BURN IN
STANDARD SOCKETS FOR BURN IN AND TESTS
BGA/CSP, LGA Packages
QFN packages
Sockets Axial-Radial & MELF packages
Sockets for TO, SIP, DIP packages
LCC, FlatPack, SMD, Microwave & Hybrids
ZigZag sockets & Staggered
Sockets for PLCC/SOJ & "Gull Wing" packages
Optical transceiver sockets & PGA
Connectors
BURN IN BOARDS - HUMIDITY & HAST BOARDS
SPRING POGO PINS
TESTS INTERFACE BOARDS
INSTRUMENTS & SOFTWARES
COMPONENT HANDLING & PACKAGING MATERIALS
Materials for ESD protection
Microhandling & Micro-tools
SUBCONTRACT SERVICES PROTOTYPES
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